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 HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter
Features
MCU Features
*
MCU Operating voltage: fSYS= 4MHz: 2.2V~3.6V fSYS= 8MHz: 3.0V~3.6V Power Down modes and wake-up functions to reduce power consumption Oscillator types - External high frequency Crystal - External RC - Internal RC - External low frequency crystal - Watchdog Timer Internal RC Oscillator Three operational modes: Normal, Slow, Sleep Fully integrated internal 4MHz, 8MHz oscillator requires no external components OTP Program Memory: 1K15 RAM Data Memory: 968 Watchdog Timer function All instructions executed in one or two instruction cycles Table read instructions 63 powerful instructions 6-level subroutine nesting Bit manipulation instruction Low voltage reset function 16-pin NSOP package type Up to 8 bidirectional I/O lines 4 channel 12-bit ADC 1 channel 8-bit PWM External interrupt input shared with an I/O line Two 8-bit programmable Timer/Event Counter with overflow interrupt and prescaler Time-Base function Programmable Frequency Divider - PFD
* *
* * * * * * * * * * * * * * * * * * *
RF Transmitter Features
* * * * * * *
Complete UHF ASK/OOK transmitter Frequency range 300MHz to 450MHz Data rates more than 10k bps Output Power up to 10dBm Low voltage operation - down to 2.2V Data tracking function for power saving Reference clock output for MCU IRC clock synchronisation
Rev. 1.30
1
November 23, 2010
HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter
General Description
These devices provide a combination of a fully featured MCU plus an RF transmitter function, giving them great flexibility for use in wide range of wireless I/O control applications such as industrial control, consumer products, subsystem controllers, etc. Analog features include a multi-channel 12-bit A/D converter. Multiple and extremely flexible Timer/Event Counters provide full timing functions. Protective features such as an internal Watchdog Timer and Low Voltage Reset coupled with excellent noise immunity and ESD protection ensure that reliable operation is maintained in hostile electrical environments. An extensive choice of oscillator functions are provided including a fully integrated system oscillator which requires no external components for its implementation. The ability to operate and switch dynamically between a range of operating modes using different clock sources gives users the ability to optimise microcontroller operation and minimise power consumption. The devices also include flexible I/O programming features Time-Base functions and a range of other features. The RF transmitter is a high performance and easy to use transmitter operating in the 300MHz to 450MHz frequency band. One only needs to add a crystal reference frequency, and a limited number of external components to create a complete and versatile RF transmitter system. The device is capable of delivering more than +9dBm into a 50W load. Such a power level enables a small form factor transmitter to operate near the maximum limit of the transmission regulations. The device can operate with ASK - Amplitude Shift Keying, and OOK - On-Off Keying, UHF receiver types from wide-band super-regenerative radios to narrow-band, high performance super-heterodyne receivers. The data rate is higher than 10kbps, allowing the device to support more complicated control protocols. For enhanced power saving, the device includes a data tracking function. The data tracking function enables the PLL to be activated as long as high transient data input trigger signals are received. The PLL will also be automatically switched off if there are no data input transients for a time exceeding approximately 300ms. As there is a reference clock input on line PB0, the MCU can use its internal RC clock rather than using an additional crystal for the system clock. These features add up to ensure that the devices can offer excellent capabilities in terms of functionality and power-saving as well as being highly cost effective in a huge range of remote wireless applications
Selection Guide
Part No. HT48R01T3 HT46R01T3 Program Data Memory Memory 1K15 1K15 968 968 I/O 9 9 8-bit Timer 2 2 Time Base 1 1 RF Transmitter O O A/D 3/4 PWM 3/4 Stack Package 6 6 16NSOP 16NSOP
12-bit4 8-bit1
Rev. 1.30
2
November 23, 2010
HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter
Block Diagram
The following block diagram illustrates the dual-chip structure of the devices, where an individual MCU and RF Transmitter devices are combined into a single package.
V
DD
AV P B 1 /D O U T
DD
P A 0 /A N 0 P A 1 /P F D /A N 1 P A 2 /T M R 0 /A N 2 P A 3 /IN T /A N 3 P A 4 /P W M /T M R 1 P A 5 /O S C 2 P A 6 /O S C 1 P A 7 /R E S H T46R 01B H T48R 01B PB1 PB0 D IN CREF EN R F M o d u le PAOUT XOUT X IN
VSS
AV
SS
Internal Chip Interconnection Diagram Note: The PWM and AN0~AN3 shared-pin functions only exist in the HT46R01T3 device.
Low V o lta g e R eset PW M D r iv e r PFD D r iv e r RF T r a n s m itte r I/O P o rts
W a tc h d o g T im e r R eset C ir c u it 8 - b it R IS C MCU C o re In te rru p t C o n tr o lle r E x te rn a l R C /X T O s c illa to r
A /D C o n v e rte r
T im e r s
T im e B ase
In te rn a l O s c illa to r
Note: The PWM and A/D Converter functions only exist in the HT46R01T3 device.
Rev. 1.30
3
November 23, 2010
HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter
Pin Assignment
P B 1 /D O U T 1 2 3 4 5 6 7 8 P A 3 /IN T /A N 3 P A 2 /T M R 0 /A N 2 P A 1 /P F D /A N 1 P A 0 /A N 0 VSS AVSS PAOUT 16 15 14 13 12 11 10 9 P A 4 /P W M /T M R 1 P A 5 /O S C 2 P A 6 /O S C 1 P A 7 /R E S VDD XOUT X IN AVDD P B 1 /D O U T 1 2 3 4 5 6 7 8 P A 3 /IN T P A 2 /T M R 0 P A 1 /P F D PA0 VSS AVSS PAOUT 16 15 14 13 12 11 10 9 P A 4 /T M R 1 P A 5 /O S C 2 P A 6 /O S C 1 P A 7 /R E S VDD XOUT X IN AVDD
H T46R 01T3 1 6 N S O P -A
H T48R 01T3 1 6 N S O P -A
Pin Description
HT46R01T3
Pin Name PA0/AN0 AN0 PA1 PA1/PFD/AN1 PFD AN1 PA2 PA2/TMR0/AN2 TC0 AN2 PA3 PA3/INT/AN3 INT AN3 PA4 PA4/TMR1/PWM TC1 PWM PA5 PA5/OSC2 OSC2 PA6 PA6/OSC1 OSC1 PA7 PA7/RES RES Function PA0 OPT PAPU PAWK ADCR PAPU PAWK CTRL0 ADCR PAPU PAWK 3/4 ADCR PAPU PAWK 3/4 ADCR PAPU PAWK 3/4 CTRL0 PAPU PAWK CO PAPU PAWK CO PAWK CO I/T ST AN ST 3/4 AN ST ST AN ST ST AN ST ST 3/4 ST 3/4 ST OSC ST ST O/T Description
CMOS General purpose I/O. Register enabled pull-up and wake-up. 3/4 A/D channel 0
CMOS General purpose I/O. Register enabled pull-up and wake-up. CMOS PFD output 3/4 A/D channel 1
CMOS General purpose I/O. Register enabled pull-up and wake-up. 3/4 3/4 External Timer 0 clock input A/D channel 2
CMOS General purpose I/O. Register enabled pull-up and wake-up. 3/4 3/4 External interrupt input A/D channel 3
CMOS General purpose I/O. Register enabled pull-up and wake-up. 3/4 External Timer 1 clock input
CMOS PWM output CMOS General purpose I/O. Register enabled pull-up and wake-up. OSC Oscillator pin
CMOS General purpose I/O. Register enabled pull-up and wake-up. 3/4 3/4 Oscillator pin
NMOS General purpose I/O. Register enabled wake-up. Reset input
Rev. 1.30
4
November 23, 2010
HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter
Pin Name Function PB1 PB1/DOUT DOUT PAOUT XOUT XIN VDD VSS AVDD AVSS Note: PAOUT XOUT XIN VDD VSS AVDD AVSS 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 HXT PWR PWR PWR PWR OPT PBPU I/T ST O/T Description
General purpose I/O. Register enabled pull-up. CMOS Internally connected to DIN pin on RF module. Must be setup as output for interfacing to RF module. 3/4 NSO HXT 3/4 3/4 3/4 3/4 3/4 Data output from MCU to RF module Connected internally to PB1 RF power amplifier output RF chip crystal pin RF chip crystal pin MCU power supply MCU ground RF chip power supply RF chip ground
I/T: Input type O/T: Output type OPT: Optional by configuration option (CO) or register option PWR: Power CO: Configuration option ST: Schmitt Trigger input CMOS: CMOS output NSO: Non-standard output
HT48R01T3
Pin Name PA0 Function PA0 PA1 PA1/PFD PFD PA2 PA2/TMR0 TC0 PA3 PA3/INT INT PA4 PA4/TMR1 TC1 PA5 PA5/OSC2 OSC2 PA6 PA6/OSC1 OSC1 OPT PAPU PAWK PAPU PAWK CTRL0 PAPU PAWK 3/4 PAPU PAWK 3/4 PAPU PAWK 3/4 PAPU PAWK CO PAPU PAWK CO I/T ST ST 3/4 ST ST ST ST ST ST ST 3/4 ST OSC O/T Description
CMOS General purpose I/O. Register enabled pull-up and wake-up. CMOS General purpose I/O. Register enabled pull-up and wake-up. CMOS PFD output CMOS General purpose I/O. Register enabled pull-up and wake-up. 3/4 External Timer 0 clock input
CMOS General purpose I/O. Register enabled pull-up and wake-up. 3/4 External interrupt input
CMOS General purpose I/O. Register enabled pull-up and wake-up. 3/4 External Timer 1 clock input
CMOS General purpose I/O. Register enabled pull-up and wake-up. OSC Oscillator pin
CMOS General purpose I/O. Register enabled pull-up and wake-up. 3/4 Oscillator pin
Rev. 1.30
5
November 23, 2010
HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter
Pin Name PA7/RES RES PB1 PB1/DOUT DOUT PAOUT XOUT XIN VDD VSS AVDD AVSS Note: PAOUT XOUT XIN VDD VSS AVDD AVSS 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 HXT PWR PWR PWR PWR CO PBPU ST ST Function PA7 OPT PAWK I/T ST O/T Description
NMOS General purpose I/O. Register enabled wake-up. 3/4 Reset input
General purpose I/O. Register enabled pull-up. CMOS Internally connected to DIN pin on RF module. Must be setup as output for interfacing to RF module. 3/4 NSO HXT 3/4 3/4 3/4 3/4 3/4 Data output from MCU to RF module Connected internally to PB1 RF power amplifier output RF chip crystal pin RF chip crystal pin MCU power supply MCU ground RF chip power supply RF chip ground
I/T: Input type O/T: Output type OPT: Optional by configuration option (CO) or register option PWR: Power CO: Configuration option ST: Schmitt Trigger input CMOS: CMOS output NSO: Non-standard output
Internally Connected Pins
In addition to the internal connection between MCU pin, PB1, and RF Transmitter pin, DIN, the MCU pin, PB0, and RF Transmitter pin, CREF, are also internally connected. However it should be noted that PB0/CREF is not connected to any external pins on the device package.
Pin Name Function OPT I/T O/T Description General Purpose I/O. Register enabled pull-high resistor. Internally connected to CREF pin on RF module. Must be setup as an input for interfacing to RF module. Not available on package. RF Transmitter generated pulses for synchronisation. Connected internally to PB0. Not available on package.
PB0 PB0/CREF CREF
PBPU
ST
CMOS
3/4
3/4
3/4
Rev. 1.30
6
November 23, 2010
HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter
D.C. Characteristics
Test Conditions Symbol Parameter VDD VDD AVDD IDD1 IDD2 ISTB1 ISTB2 ISTB3 VIL1 VIH1 VIL2 VIH2 VLVR1 VLVR2 IOL IOH RPH Operating Voltage RF Transmitter Power Supply Operating current (Crystal OSC, RC OSC) Operating Current (internal RC+RTC OSC, Normal Mode) Standby Current (WDT OSC on, RTC off) Standby Current (WDT OSC off, RTC off) Standby Current (WDT OSC off, RTC on) Input Low Voltage for PA, PB, TMR0, TMR1, INT Input High Voltage for PA, PB, TMR0, TMR1, INT Input Low Voltage (RES) Input High Voltage (RES) Low Voltage Reset 1 Low Voltage Reset 2 I/O Port Sink Current for PA, PB 3/4 3/4 3V 3V 3V 3V 3V 3/4 3/4 3/4 3/4 3/4 3/4 3V Conditions fSYS=4MHz fSYS=8MHz 3/4 No load, fSYS=4MHz, ADC disable No load, fSYS=4MHz, ADC disable No load, system HALT No load, system HALT No load, system HALT, RTC osc slowly start-up 3/4 3/4 3/4 3/4 Configuration option=2.1V Configuration option=3.15V VOL=0.1VDD VOH=0.9VDD 3/4 2.2 3.3 2.0 3/4 3/4 3/4 3/4 3/4 0 0.7VDD 0 0.9VDD 1.98 2.98 4 -2 20 3/4 3/4 3/4 1 1 3/4 3/4 3/4 3/4 3/4 3/4 3/4 2.10 3.15 8 -4 60 3.6 3.6 3.6 2 2 5 1 5 0.3VDD VDD 0.4VDD VDD 2.22 3.32 3/4 3/4 100 V V V mA mA mA mA mA V V V V V V mA mA kW Min. Typ. Max. Unit Ta=25C
I/O Port Source Current for PA, PB 3V Pull-high Resistance for I/O 3V
Rev. 1.30
7
November 23, 2010
HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter
A.C. Characteristics
Test Conditions Symbol Parameter VDD fHIRC System Clock (HIRC) Timer Input Frequency (TCn) 3V Conditions Ta= -40C~85C 2.2V~3.6V 3.3V~3.6V 3/4 3/4 Wake-Up from HALT 3/4 3/4 -10% 0 0 45 1 3/4 1 0.25 4/8 3/4 3/4 90 3/4 1024 3/4 1.00 +10% 4000 8000 180 3/4 3/4 3/4 2.00 MHz kHz kHz ms ms tSYS ms ms Min. Typ. Max. Unit Ta=25C
fTIMER
3/4 3V 3/4 3/4 3/4 3/4
tWDTOSC Watchdog Oscillator Period tRES tSST tINT tLVR Note: External Reset Low Pulse Width System Start-up Time Period Interrupt Pulse Width Low Voltage Width to Reset
1. tSYS=1/fSYS 2. *For fERC, as the resistor tolerance will influence the frequency a precision resistor is recommended.
A/D Converter Electrical Characteristics
Test Conditions Symbol VADC VADI VREF Parameter VDD A/D Operating Voltage A/D Converter Input Voltage A/D Converter Input reference Voltage Range A/D Converter Differential Non-Linearity A/D Converter Integral Non-Linearity Additional Power Consumption if A/D Converter is Used A/D Converter Clock Period A/D Converter Sampling Time (see note) A/D Converter on to ADC Start 3/4 3/4 3/4 2.7V 3V 2.7V 3V 3V 2.7V~ 3.6V VADC=3V VREF=VADC=VDD, tAD=0.5ms VREF=VADC=VDD, tAD=0.5ms (calculated on best-fit line) No load, tAD=0.5ms 3/4 Conditions VREF=VADC 3/4 2.7 0 TBD (TBC) -2 3/4 3/4 3/4 3/4 3.6 VADC/ VREF VADC +0.1 2 Min. Typ. Max.
Ta=25C
Unit V V V
DNL
LSB
INL
-4
3/4
4
LSB
IADC tAD tADC tON2ST Note:
3/4 0.5 3/4 2
0.5 3/4 16 3/4
3/4 10 3/4 3/4
mA ms tAD ms
2.7V~ 12-bit ADC 3.6V 2.7V~ 3.6V 3/4
ADC conversion time (tAD)= n (bits ADC) + 4 (sampling time), the conversion for each bit needs one ADC clock(tAD).
Rev. 1.30
8
November 23, 2010
HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter
RF Transmitter Electrical Characteristics
Specifications apply for AVDD=3.0V, Ta = 25C, Freq Xtal OSC=13.560MHz, DATA is transmitting. Bold values indicate -20C to 70C unless otherwise noted. 1kbps data rate 50% duty cycle. RL 50W load (matched)
Test Conditions Symbol Parameter AVDD II Data High Current 3V @433.92MHz @315MHz IO Data Low Current 3V @433.92 MHz @315MHz ISTB EN Low & DIN Low Current 3V @433.92 MHz RF and Crystal @315MHz * Output power level 3.3V @433.92MHz * @630MHz, 2nd harm Harmonics output for 315 MHz 3V @945MHz, 3rd harm @867.84MHz, 2nd harm Harmonics Output for 433.92MHz Extinction Ratio for ASK 10Kbps Data Rate Occupied Bandwidth 3V @1301.76MHz, 3rd harm 3V 3V 3V @433.92MHz 315MHz Single Side Band Phase Noise 433.92MHz Single Side Band Phase Noise XTLIN, XTLOUT Output Blanking 100kHz from Carrier 3V 1000kHz from Carrier 100kHz from Carrier 3V 1000kHz from Carrier 3V 3V Pin capacitance Standby transition from low to high ** Delta between ASK input transition from Low To High to RF output transition from low to high @315MHz CREF Clock Output Frequency Note: * Depend on PC board layout ** Generally limited by crystal 3V @433.92MHz 3/4 3/4 @315MHz 3/4 3/4 3/4 3/4 3/4 3/4 3/4 10 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 9.5 9.5 -48 -60 -45 -55 70 3/4 <900 <1000 -78 -77 -78 -76 2 500 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 dBm dBm dBc dBc dBc dBc dBc kbps kHz kHz dBc/Hz dBc/Hz dBc/Hz dBc/Hz pF ms Conditions @315MHz, POUT=+10dBm 3/4 3/4 3/4 3/4 3/4 3/4 12.5 12.5 3.0 3.0 1.0 1.0 3/4 3/4 3/4 3/4 3/4 3/4 mA mA mA mA mA mA Min. Typ. Max. Unit
ASK to RF Out Response Time
3V
3/4
1
3/4
ms
3/4 3/4
150 207
3/4 3/4
Hz Hz
Rev. 1.30
9
November 23, 2010
HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter
Power-on Reset Characteristics
Test Conditions Symbol Parameter VDD VPOR RRVDD VDD Start Voltage to Ensure Power-on Reset VDD raising rate to Ensure Power-on Reset 3/4 3/4 Conditions 3/4 3/4 Ta=25C, without 0.1mF between VDD and VSS Ta=-40C~85C, without 0.1mF between VDD and VSS without 0.1mF between VDD and VSS without 0.1mF between VDD and VSS 3/4 0.035 3/4 3/4 100 3/4 mV V/ms Min. Typ. Max. Unit Ta=25C
0.9
3/4
1.5
V
VPOR MAX
Maximum VDD Start Voltage to Ensure Power-on Reset
3/4
0.6
3/4
1.8
V
2 TBD
tPOR
Power-on Reset Low Pulse Width
3/4 3/4
3/4 3/4
ms ms
3/4
V
DD
tP
OR
RR
VDD
V
POR
T im e
Functional Description
As these device packages contain different chips, for a detailed functional description, users must refer to the relevant datasheets for the related MCU. The following table shows which individual devices are inside each package.
Device HT48R01T3 HT46R01T3 MCU HT48R01B HT46R01B
Multi-chip Internal Devices
The MCU controls the RF transmitter via a two line interface using two of its I/O pins, PB0 and PB1. Pin PB1, which should be setup as an output by the MCU, is used to generate the encoding data. Pin PB0, which should be setup as an input by the MCU, is used for synchronising purposes. There are some special considerations which need to be taken into account when using these devices. These points will be mentioned in the hardware and software consideration sections.
Hardware Considerations
As these devices are composed of an individual MCU and RF Transmitter, using them together requires the user to take care of some special points.
Rev. 1.30
10
November 23, 2010
HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter
Absolute Maximum Ratings
The Absolute Maximum Ratings must be checked for discrepancies and the necessary care taken in device handling and usage.
Power Supply
Examination of the block diagram will reveal that the Power Supply and Ground pins of the RF Transmitter and MCU are independent and must be connected together if they are to share the same power supply. If the same power supply is to be used for both chips then care must be taken as both have different power supply requirements. When calculating the total current consumption of the device, the internal DC specification currents for the MCU and RF parts must be added together. The RF data to be transmitted is derived from the PB1 line. When the PB1 line is high the device will transmit allowing users to program their encoded data on this line. If the RF transmitter is in its standby mode then there will be a delay of about 500ms before transmission begins. When the device is transmitting, a synchronising signal will be generated on the CREF/PB0 pin which allows the MCU to use it to calibrate its internal RC oscillator. To avoid the RF circuits entering an unknown state, pin PB1 should be setup as an output as soon as possible after power-on. To minimise power consumption, only when PB1 is high, can the RF signal be transmitted and the reference clock on PB0 be generated. If no data transitions are generated on PB1 for 300~500ms, the transmitter will enter a standby state and the RF circuits will be switched off along with the internal PLL to save power. The signal generated on the CREF/PB0 line will also remain at a low level. The internal PLL function is used to generate the RF frequency with a multiplier of 32 times the crystal frequency. The relationship is: RF frequency = 32 Crystal frequency. Therefore a 9.84375MHz crystal will generate an RF frequency of 315MHz and a13.56MHz crystal will generate an RF frequency of 433.92MHz. All PLL circuits are contained within the device and the only external component required is a suitable crystal.
Power Down and Wake up
It is important to note that if the MCU is powered down or placed into a low power mode to conserve power, that the RF Transmitter may continue running and will consume a certain amount of power. Before powering down the MCU it is important to carefully manage the PB1 pin to ensure the RF-Transmitter enters its power down state.
Programming Considerations
As MCU lines PB0 and PB1 are used to control the RF transmitter function, care must be taken to manage these lines correctly in the application program. As line PB1 is used to send data to the RF circuitry this line must be setup as an output. To avoid erroneous operation of the RF circuits this line should be setup as an output immediately after power-on. The PB0 pin on the MCU is used to receive synchronising pulses from the RF circuits and should therefore be setup as an input. As the MCU will be powered down independently of the RF Transmitter Peripheral Module, care must be taken to ensure that the MCU first clears its PB1 line to zero before powering down. This will allow the RF Transmitter Peripheral Module to enter its standby state and thus keep power consumption to a minimum.
Rev. 1.30
11
November 23, 2010
HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter
Application Circuits
Note:
1. 9.84375MHz crystal used for RF frequency of 315MHz 13.56MHz crystal used for RF frequency of 433.92MHz 2. The extra LC filter on the PAOUT pin can reduce second harmonics 3. The L and C values shown in brackets are for 433.92MHz
Rev. 1.30
12
November 23, 2010
HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter
Package Information
16-pin NSOP (150mil) Outline Dimensions
A 1
16 9 8
B
C C' G H D E F
=
MS-012 Symbol A B C C D E F G H a Symbol A B C C D E F G H a Dimensions in inch Min. 0.228 0.150 0.012 0.386 3/4 3/4 0.004 0.016 0.007 0 Nom. 3/4 3/4 3/4 3/4 3/4 0.050 3/4 3/4 3/4 3/4 Dimensions in mm Min. 5.79 3.81 0.30 9.80 3/4 3/4 0.10 0.41 0.18 0 Nom. 3/4 3/4 3/4 3/4 3/4 1.27 3/4 3/4 3/4 3/4 Max. 6.20 3.99 0.51 10.21 1.75 3/4 0.25 1.27 0.25 8 Max. 0.244 0.157 0.020 0.402 0.069 3/4 0.010 0.050 0.010 8
Rev. 1.30
13
November 23, 2010
HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter
Reel Dimensions
T2 D
A
B
C
T1
SOP 16N (150mil) Symbol A B C D T1 T2 Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness Dimensions in mm 330.01.0 100.01.5 13.0
+0.5/-0.2
2.00.5 16.8
+0.3/-0.2
22.20.2
Rev. 1.30
14
November 23, 2010
HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter
Carrier Tape Dimensions
P0 D
E F W C
P1
t
B0
D1
P A0
K0
R e e l H o le IC p a c k a g e p in 1 a n d th e r e e l h o le s a r e lo c a te d o n th e s a m e s id e .
SOP 16N (150mil) Symbol W P E F D D1 P0 P1 A0 B0 K0 t C Description Carrier Tape Width Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Carrier Tape Thickness Cover Tape Width Dimensions in mm 16.00.3 8.00.1 1.750.1 7.50.1 1.55 1.50
+0.10/-0.00 +0.25/-0.00
4.00.1 2.00.1 6.50.1 10.30.1 2.10.1 0.300.05 13.30.1
Rev. 1.30
15
November 23, 2010
HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter
Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shenzhen Sales Office) 5F, Unit A, Productivity Building, No.5 Gaoxin M 2nd Road, Nanshan District, Shenzhen, China 518057 Tel: 86-755-8616-9908, 86-755-8616-9308 Fax: 86-755-8616-9722 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538, USA Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com
Copyright O 2010 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holteks products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw.
Rev. 1.30
16
November 23, 2010


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